1.In order to enlarge the business coverage of overseas markets based on multi-channel, Helixin has already upgraded its English website.The new website brings you more friendly interface, and much easier to get the information about what you interesting.2.The tabular selection bar allows you to view products more intuitively by product categories(Reflow Soldering, Wave Soldering, Peripheral Equip...
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Wave soldering and reflow soldering are two common electronic product welding methods in electronic products manufacturing process.Difference between wave soldering and reflow soldering:Reflow process is achieved by re melting the pre paste to the printed board pad on the paste soft solder, to achieve surface assembly components, welding ends or between the pin and printed board pad, mechanical an...
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According to the shape classificationDesktop reflow oven: desktop equipment suitable for small batch production of the PCB assembly, stable performance and economic price (between about 4-8 million yuan), domestic private enterprises and state-owned units with the more.Vertical reflow oven: vertical equipment models are more suitable for different needs of users, PCB assembly. The equipment has hi...
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Soldering is let board welding surface directly with high temperature liquid tin to achieve the purpose of welding, the high temperature liquid tin keep a slant, and by a special device to make the liquid tin forming a similar wave phenomenon, so called "wave", the main material is solder.Wave soldering refers to the solder alloy melted by electric pump or the electromagnetic pump jet in...
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In recent years, with the development of electronic products to many small, light, high density direction, especially the use of handheld equipment, components in material technology are the original SMT technology has posed a severe challenge, so that SM got rapid development opportunities. From the lC pin to 0.5mm, 0.4mm, 0.3mm development, BGA has been widely used, CSP also emerge, and showing ...
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